HeraLock™ 2000 self-constrained LTCC tape

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4828, Issue , 2002, Pages 143-149

  Lautzenhiser, Frans ^a   Amaya, Edmar ^a  

^a Heraeus CMD   (United States)

Author keywords

Cavity structures; Constrained sintering; LTCC; Microwave; Opto electronic; RF materials

Indexed keywords

FIRING (OF MATERIALS); FITS AND TOLERANCES; MICROWAVES; OPTOELECTRONIC DEVICES; SHRINKAGE; SINTERING; TAPES;

LOW-TEMPERATURE CO-FIRED CERAMIC (LTCC);

CERAMIC MATERIALS;

EID: 0036421920     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Mike Barker & Rick Draudt, "Zero Shrink Process for Cost Sensitive High Volume LTCC Applications," Proceedings of the 2001 International Symposium on Microelectronics (IMAPS), October 9-11, pp. 26 - 31, 2001.
2. Anwar A. Mohamed, "Feasibility Study to evaluate LTCC for High Power RF Applications" Article to be published 2002, Ultra RF Inc.
3. A., Fathy et al. "Design of Embedded Passive Components in LTCC-M Technology" IEEE MTT-S Digest, pp. 1281 - 1284, 1998.
4. W. Wersing et Al. "Integrated Passive Components Using LTCC" Paper to be published, Siemens AG.
5. Samuel Horowitz & Daniel Amey, "Ceramics Meet Next-Generation Fiber Optic Packaging Requirements" Photonic Spectra, pp. 123-126, November, 2001.