Thermally optimised millimeter wave package on an LTCC ceramic board

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 355-360

  Sommer, J P ^a   Michel, B ^a   Goebel, U ^a   Jelonnek, J ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HEAT RESISTANCE; MILLIMETER WAVE DEVICES; MULTICHIP MODULES; SEMICONDUCTING GALLIUM ARSENIDE; THERMOANALYSIS;

COMMUNICATION OUTDOOR UNIT; LOW TEMPERATURE COFIRED CERAMIC MULTILAYER SUBSTRATES; MILLIMETER WAVE PACKAGE; MILLIMETERWAVE MODULES;

ELECTRONICS PACKAGING;

EID: 0033709715     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)