Curvature evolution in LTCC tapes and laminates

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 1, 2005, Pages 149-156

  Li, Wenxia ^a   Lannutti, John J ^a  

^a Ohio State University   (United States)

Author keywords

Integrated circuits (ICs); Low temperature cofired ceramic (LTCC); Microslumping; Radio frequency (RF)

Indexed keywords

ANISOTROPY; CERAMIC MATERIALS; FINITE DIFFERENCE METHOD; INTEGRATED CIRCUITS; LAMINATES; MATHEMATICAL MODELS; SINTERING; THERMODYNAMICS;

LOW TEMPERATURE COFIRED CERAMIC (LTCC); MICROSLUMPING; RADIO FREQUENCY (RF);

ELECTRONICS PACKAGING;

EID: 15744401634     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.838860     Document Type: Article

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