Improvements in noise suppression for I/O circuits using embedded planar capacitors

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 2, 2008, Pages 234-245

  Muthana, Prathap ^a   Srinivasan, Krishna ^a   Engin, Arif Ege ^a   Swaminathan, Madhavan ^a   Tummala, Rao ^a   Sundaram, Venkatesh ^a   Wiedenman, Boyd ^a   Amey, Daniel I ^b   Dietz, Karl H ^b   Banerji, Sounak ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b DUPONT COMPANY   (United States)

Author keywords

Decoupling capacitors; Embedded planar capacitors; Measurement; Modal decomposition; Modeling; Package; Power delivery; Simulation; Simultaneous switching noise

Indexed keywords

CAPACITORS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; INTERFERENCE SUPPRESSION;

DECOUPLING CAPACITORS; EMBEDDED PLANAR CAPACITORS; MODAL DECOMPOSITION; SIMULTANEOUS SWITCHING NOISE (SSN);

SPURIOUS SIGNAL NOISE;

EID: 44449139572     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.920651     Document Type: Article

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