Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 129-132

  Kim, Hyunesoo ^a   Jeong, Youchul ^a   Park, Jongbae ^a   Seok, Kyu Lee ^b   Jong, Kuk Hong ^b   Hong, Youngsoo ^c   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

^c SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; ELECTRONICS PACKAGING; INDUCTANCE; POLYCHLORINATED BIPHENYLS;

EMBEDDED CAPACITOR FILMS; FILM CAPACITORS; FREQUENCY RANGES; HIGH-PERFORMANCE PACKAGES; SIMULTANEOUS SWITCHING NOISE;

DIELECTRIC MATERIALS;

EID: 4644278388     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250015     Document Type: Conference Paper

References (4)

1. Larry D. Smith, Raymond E. Anderson, Douglas W. Forehand, Thomas J. Pelc, and Tanmoy Roy, "Power Distribution System Design Methodology and Capacitor Selection of Modern CMOS Technology", IEEE Trans on AP, vol. 22, no. 3, August, 1999.
2. M. Xu, T.H. Hubing, J. Chen, T.P. Van Doren, J.L. Drewnial, and R.E. DuBroff, "Power-Bus Decoupling with Embedded Capacitance in Printed Circuit Board Design", IEEE Trans on EMC, vol. 45, no. 1, pp 22-30, February 2003.
3. Joseph M. Hobbs, Hitesh Windlass, Venky Sundaram, Sungjun Chun, George E. White, Madhavan Swaminathan, Rao R. Tummala, "Simultaneous Switching Noise Suppression for High Speed Systems Using Embedded Decoupling", 2001 Electronic Components and Technology Conference, 2001.
4. An Madou and Luc Martens, "Electrical Behavior of Decoupling Capacitors Embedded in Multilayered PCBs", IEEE Trans on EMC, vol. 43, no. 4, November 2001.