Using embedded capacitance to improve electrical performance, eliminate capacitors and reduce board size in high speed digital and RF applications

IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

Volumn 2, Issue , 2007, Pages 1087-1136

  Peiffer, Joel S ^a   Giesler, Mike ^a  

^a 3M COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOARD SIZE; ELECTRICAL PERFORMANCE; EMBEDDED CAPACITOR; EMBEDDED PASSIVES; INDUSTRY STANDARDS; LEAD TIME; LEAD-FREE ASSEMBLY; RELIABILITY TEST; RF APPLICATIONS; SYSTEM COSTS; ULTRA-THIN;

CAPACITORS; DIELECTRIC MATERIALS; EXHIBITIONS;

PRINTED CIRCUITS;

EID: 84866947416     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. rd International Conference on Embedded Passives, May 2006
2. Bruce Archambeault, Preliminary Test Data, 3M Embedded Capacitance vs. Typical Board, March 2005 (unpublished)
3. Joel S. Peiffer and William Balliette, "Decoupling of High Speed Digital Electronics with Embedded Capacitance", IMAPS ATW on Integrated Passives, January 2005
4. Joel S. Peiffer, "The History of Embedded Distributed Capacitance", Printed Circuit Design and Manufacture, August 2004
5. nd International Conference on Embedded Passives, June 2004
6. Joel S. Peiffer, "Ultra-Thin, Loaded Epoxy Materials for Use as Embedded Capacitor Layers", Printed Circuit Design and Manufacture, April 2004
7. Advanced Embedded Passives Technology (AEPT) Program Report, September, 2003. National Center for Manufacturing Sciences, Ann Arbor, Michigan
8. Joel S. Peiffer, "Ultra-Thin, Loaded Epoxy Materials for Use as Embedded Capacitor Layers", IPC International Conference on Embedded Passives, June 2003
9. Joel S. Peiffer, Bob Greenlee and Istvan Novak, "Electrical Performance Advantages of Ultra-Thin Dielectric Materials Used for Power-Ground Cores in High Speed, Multilayer Printed Circuit Boards", IPC Expo 2003 Proceedings, March 2003
10. M. Xu, T. Hubing, J. Chen, T. Van Doren, J. Drewniak and R. DuBroff, "Power-Bus Decoupling With Embedded Capacitance in Printed Circuit Board Design", IEEE Transactions on Electromagnetic Compatibility, Vol. 45, No. 1, February 2003
11. Joel S. Peiffer, NIST Advanced Embedded Passives Technology (AEPT) Industry Seminar, January, 2003
12. Bob Greenlee, "Processing Thin Core Capacitor Materials", IPC Expo 2002 Proceedings, March 2002
13. Embedded Decoupling Capacitance (EDC) Project Final Report, December, 2000. National Center for Manufacturing Sciences, Ann Arbor, Michigan