High-impedance electromagnetic surfaces for parallel-plate mode suppression in high-speed digital systems

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 279-282

  Kamgaing, Telesphor ^a,c   Ramahi, Omar M ^b,c  

^a MOTOROLA INC   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING;

EMI SHIELDING; HIGH SPEED CIRCUIT; HIGH-IMPEDANCE ELECTROMAGNETIC SURFACES; HIGH-SPEED DIGITAL SYSTEMS; PARALLEL PLATE MODES;

ELECTROMAGNETIC SHIELDING;

EID: 4544336176     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057932     Document Type: Conference Paper

References (9)

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