SCOPUS 정보 검색 플랫폼

Volumn 103, Issue 9, 2008, Pages

Very high current density package level electromigration test for copper interconnects

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER COMPOUNDS; CURRENT DENSITY; ELECTROMIGRATION; JOULE HEATING; LINEWIDTH;

COPPER INTERCONNECTS; CURRENT DENSITY EXPONENTS; DUAL DAMASCENE (DD);

INTERCONNECTION NETWORKS;

EID: 43949092775 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.2917065 Document Type: Article

Times cited : (25)

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