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Volumn 2003-January, Issue , 2003, Pages 69-74

Joule heating-assisted electromigration failure mechanisms for dual damascene Cu/SiO2 interconnects

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION BARRIERS; ELECTROMIGRATION; FAILURE ANALYSIS; HEATING; INTEGRATED CIRCUIT INTERCONNECTS; JOULE HEATING;

EID: 84942411561     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPFA.2003.1222741     Document Type: Conference Paper
Times cited : (10)

References (12)
  • 1
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    • T. Nitta, T. Ohmi, M. Otsuki, T. Takewaki and T. Shibata, "Electrical properties of giant-grain copper thin films formed by a low kinetic energy particle process," J Electrochem. Soc., vol. 139, p. 922, 1992.
    • (1992) J Electrochem. Soc. , vol.139 , pp. 922
    • Nitta, T.1    Ohmi, T.2    Otsuki, M.3    Takewaki, T.4    Shibata, T.5
  • 3
    • 0000555230 scopus 로고    scopus 로고
    • Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnects
    • C.K. Hu, L. Gignac, S.G. Malhotra, R Rosenherg and S. Boettcher, "'Mechanisms for very .long electromigration lifetime in dual-damascene Cu interconnects," App. Phys. Letters, vol. 78, p. 904,2001.
    • (2001) App. Phys. Letters , vol.78 , pp. 904
    • Hu, C.K.1    Gignac, L.2    Malhotra, S.G.3    Rosenherg, R.4    Boettcher, S.5
  • 4
    • 0035456867 scopus 로고    scopus 로고
    • Electromigration performance of multi-level damascene copper interconnects
    • S. Yokogawa, N. Okada, Y. Kakuhara and H. Takizawa, "Electromigration performance of multi-level damascene copper interconnects," Microelectronics Reliability, vol. 41, p. 1409, 2001.
    • (2001) Microelectronics Reliability , vol.41 , pp. 1409
    • Yokogawa, S.1    Okada, N.2    Kakuhara, Y.3    Takizawa, H.4
  • 6
    • 0033221608 scopus 로고    scopus 로고
    • Modelling and microstructural characterization of incubation, time-dependent drift and saturation during electromigration in AI-Si-Cu stripes
    • A. Witvronw, H. Bender, P. Roussel and K. Maex, "Modelling and microstructural characterization of incubation, time-dependent drift and saturation during electromigration in AI-Si-Cu stripes," Microelechonics Reliability, vol. 39, p. 1603, 1999.
    • (1999) Microelechonics Reliability , vol.39 , pp. 1603
    • Witvronw, A.1    Bender, H.2    Roussel, P.3    Maex, K.4
  • 7
    • 0000160317 scopus 로고    scopus 로고
    • Simulations of stress evolution and the current density scalmg of electromigration-induced failure times in pure and alloyed interconnects
    • Y.J. Park, V.K. Andleigh and C.V. Thompson, "Simulations of stress evolution and the current density scalmg of electromigration-induced failure times in pure and alloyed interconnects," J. Appl. Phys., vol. 85, no.7, p. 3546, 1999.
    • (1999) J. Appl. Phys. , vol.85 , Issue.7 , pp. 3546
    • Park, Y.J.1    Andleigh, V.K.2    Thompson, C.V.3
  • 10
    • 84949215930 scopus 로고    scopus 로고
    • Investigation of via-dominated multi-modal electromigration failure distribution in dual damascene Cu interconnects with a discussion of the statistical implications
    • J. Gill, T. Sullivan, S. Yankee, H. Barth and A. von Glaslow, "Investigation of via-dominated multi-modal electromigration failure distribution in dual damascene Cu interconnects with a discussion of the statistical implications," IEEE Intemational Reliability Physics Symposium. Proceeding, p. 298,2002.
    • (2002) IEEE Intemational Reliability Physics Symposium. Proceeding , pp. 298
    • Gill, J.1    Sullivan, T.2    Yankee, S.3    Barth, H.4    Von Glaslow, A.5
  • 12
    • 0037084301 scopus 로고    scopus 로고
    • Probabilistic immortality of Cu damascene interconnects
    • S. P. Hau-Riege, "Probabilistic immortality of Cu damascene interconnects," J App. Phys., vol. 91, no.4, p. 2014,2002.
    • (2002) J App. Phys. , vol.91 , Issue.4 , pp. 2014
    • Hau-Riege, S.P.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.