The reliability performance of low cost bumping on aluminum and copper wafer

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 292-296

  Uang, Ruoh Huey ^a   Chen, Kuo Chuan ^a   Lu, Szu Wei ^a   Hu, Hsu Tien ^a   Huang, S H ^a  

^a OES/ITRI   (Taiwan)

Author keywords

Aluminum; Copper; Costs; Gold; Lithography; Sputter etching; Sputtering; Temperature; Testing; Throughput

Indexed keywords

CHIP SCALE PACKAGES; COPPER; COSTS; ELECTRONICS PACKAGING; ETCHING; FLIP CHIP DEVICES; GOLD; HIGH TEMPERATURE APPLICATIONS; LITHOGRAPHY; NICKEL; PHOTOLITHOGRAPHY; RELIABILITY; SILICON WAFERS; SOLDERING ALLOYS; SPUTTERING; TEMPERATURE; TESTING; THROUGHPUT;

EXPENSIVE EQUIPMENTS; FLIP CHIP APPLICATIONS; HIGH TEMPERATURE STORAGE; PRINTING TECHNOLOGIES; RELIABILITY PERFORMANCE; SPUTTER ETCHING; TEMPERATURE HUMIDITY; UNDER-BUMP METALLURGIES;

ALUMINUM;

EID: 0009583443     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906389     Document Type: Conference Paper

References (7)

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3. J. Audet, L. Belanger, G. Brouillette, D. Danovitch, and V. Oberson, "Low Cost Bumping Process for Flip Chip", Proc. ITAB Sump., San Jose, CA, 1995, pp161.
4. th Electronic Components and Technology Conference, May, Seattle, Washington, 1998.
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6. Joachim Kloeser, Andreas Ostmann, Jörg Gwiasda, Franz Bechtold, "Low Cost Flip Chip Technologies Based on Chemical Nickel Bumping and Solder Printing", The International Journal of Microcircuits and Electronic Packaging, Bil.20, Number 3, 3rd quarter 1997, pp 383-391.
7. th Electronic Components and Technology Conference, May, 1998, pp952-961