Electroless copper/nickel films deposited on AlN substrates

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 12, 2004, Pages 8258-8266

  Liang, Muh Wang ^a   Hsieh, Tsung Eong ^a   Chen, Chi Chin ^a   Hung, Yuan Te ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Aluminum nitride; Diffusion barrier; Electroless copper nickel; Flip chip; Surface roughness

Indexed keywords

ALUMINUM NITRIDE; ATOMIC FORCE MICROSCOPY; COPPER; DIFFUSION; ELECTRIC CONDUCTANCE; ELECTROLESS PLATING; FLIP CHIP DEVICES; NICKEL; SUBSTRATES; SURFACE ROUGHNESS;

DIFFUSION BARRIER; ELECTROLESS COPPER/NICKEL; FLIP CHIP; SURFACE-INDUCED VOIDS;

METALLIC FILMS;

EID: 13644284188     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.8258     Document Type: Article

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