Out of plane flexural behaviour of thin polysilicon films: Mechanical characterization and application of the weibull approach

Sensor Letters

Volumn 4, Issue 2, 2006, Pages 184-190

  Cacchione, Fabrizio ^a   Corigliano, Alberto ^a   De Masi, Biagio ^b   Ferrera, Marco ^b  

^a POLITECNICO DI MILANO   (Italy)

^b STMICROELECTRONICS   (Italy)

Author keywords

Bending tests; Mechanical characterization; MEMS; Polysilicon; Weibull approach

Indexed keywords

BENDING STRENGTH; BENDING TESTS; BOUNDARY ELEMENT METHOD; FINITE ELEMENT METHOD; MEMS; WEIBULL DISTRIBUTION;

DATA REDUCTION PHASES; ON-CHIP MECHANICAL TESTING; POLYSILICON FILMS;

POLYSILICON;

EID: 41549167402     PISSN: 1546198X     EISSN: None     Source Type: Journal    
DOI: 10.1166/sl.2006.016     Document Type: Article

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