Bonding of GaN structures with Si(100) substrates using sequentially deposited NiAu metal layers

Applied Physics Letters

Volumn 92, Issue 12, 2008, Pages

  Arokiaraj, J ^a   Leong, Cheong Kee ^a   Lixian, Vivian ^a   Yong, Anna Marie ^a   Xincai, Wang ^b  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

GALLIUM COMPOUNDS; NICKEL COMPOUNDS; SAPPHIRE; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

BOND GALLIUM NITRIDE; NICKEL-GOLD THIN METAL LAYERS;

SILICON COMPOUNDS;

EID: 41349084584     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2903149     Document Type: Article

References (16)

1. S. Nakumura and G. Fasol, The Blue Laser Diode, 2nd ed. (Springer, Berlin, 2000).
2. H. Ishikawa, K. Asano, B. Zhang, T. Egawa, and T. Jimbo, Phys. Status Solidi A 201, 2653 (2004).
3. A. Dadgar, F. Schulze, T. Zettler, K. Haberland, R. Clos, G. Straßburger, J. Bläsing, A. Diez, and A. Krost, J. Cryst. Growth 272, 72 (2004).
4. B. Benbakhti, M. Rousseau, A. Soltani, and J.-C. De Jaeger, IEEE Trans. Electron Devices 53, 2237 (2006).
5. U. Gösele and M. Alexe, Electrochem. Soc. Interface 9, 20 (2000).
6. A. Murai, D. B. Thompson, H. Masui, N. Fellows, U. K. Mishra, S. Nakaumara, and S. P. DenBaars, Appl. Phys. Lett. 89, 171116 (2006).
7. M. K. Kelly, O. Ambacher, R. Dimitrov, R. Handschuh, and M. Stutzmann, Phys. Status Solidi A 159, R3 (1997).
8. J. Arokiaraj, C. B. Soh, X. C. Wang, S. Tripathy, and S. J. Chua, Superlattices Microstruct. 40, 219 (2006).
9. J. Arokiaraj, H. Ishikawa, T. Soga, T. Egawa, T. Jimbo, and M. Umeno, IPAP Conf. Ser. 1, 754 (2000).
10. A. Murai, L. Mccarthy, U. Mishra, S. P. Denbaars, C. Kruse, S. Figge, and D. Hommel, Jpn. J. Appl. Phys., Part 2 43, L1275 (2004).
11. P. D. Floyd, C. L. Chua, D. W. Treat, and D. P. Bour, IEEE Photonics Technol. Lett. 10, 1539 (1998).
12. M.-H. Kim, S.-N. Lee, C. Huh, S. Y. Park, J. Y. Han, and J. M. Seo, Phys. Rev. B 61, 10966 (2000).
13. J.-L. Yang and J. S. Chen, J. Alloys Compd. 419, 312 (2006).
14. C. C. Kim, Y. K. Hwu, P. Ruterana, and J. H. Je, Mater. Phys. Mech. 4, 25 (2001).
15. T. Kozawa, T. Kachi, H. Kano, H. Nagase, N. Koide, and K. Manabe, Jpn. J. Appl. Phys., Part 1 77, 4389 (1995).
16. S.-H. Huang, R.-H. Horng, and D.-S. Wuu, Jpn J. Appl. Phys. 45, 3449 (2006).