Development of wafer level packaged scanning micromirrors

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6887, Issue , 2008, Pages

  Yu, Aibin ^a   Lee, Chengkuo ^a,b   Yan, Li Ling ^a   Zhang, Qing Xin ^a   Yoon, Seung Uk ^a   Lau, John H ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Indium; Low temperature wafer bonding; MEMS; Scanning micromirror; Wafer level packaging

Indexed keywords

FINITE ELEMENT METHOD; INDIUM; MEMS; MIRRORS; SCANNING;

LOW TEMPERATURE WAFER BONDING; SCANNING FREQUENCY; SCANNING MICROMIRROR; WAFER LEVEL PACKAGING;

WAFER BONDING;

EID: 40749118084     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.762021     Document Type: Conference Paper

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