A fluxless bonding technology using indium-silver multilayer composites

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 1, 1997, Pages 46-50

  Chen, Yi Chia ^b   So, William W ^c   Lee, Chin C ^a,c  

^a IEEE

^b Rockwell Semiconductor Systems ^*  (United States)

^c University of California at Irvine   (United States)

Author keywords

Bonding; Bonding technique; Fluxless bonding; Indium silver alloys; Metallic bonding

Indexed keywords

ACOUSTIC MICROSCOPES; BONDING; COMPOSITE MATERIALS; DEPOSITION; INDIUM ALLOYS; MULTILAYERS; PHASE DIAGRAMS; SEMICONDUCTING GALLIUM ARSENIDE; SILICON WAFERS; SILVER ALLOYS; SOLDERED JOINTS;

FLUXLESS BONDING; INDIUM SILVER MULTILAYER COMPOSITES; INTERMETALLIC GRAINS; SCANNING ACOUSTIC MICROSCOPES;

ELECTRONICS PACKAGING;

EID: 0031094262     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.558543     Document Type: Article

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