Joule heating enhanced phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu solder joints during current stressing

Journal of Electronic Materials

Volumn 37, Issue 4, 2008, Pages 469-476

  Wu, B Y ^a   Alam, M O ^a   Chan, Y C ^a   Zhong, H W ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Ball grid array (BGA) solder joints; Current stressing; Diffusion; Joule heating; Phase coarsening

Indexed keywords

BALL GRID ARRAYS; COARSENING; ELECTRONS; JOULE HEATING; KINETICS; SOLDERED JOINTS;

ATOMIC STIMULATION; BALL GRID ARRAY (BGA) SOLDER JOINTS; CURRENT STRESSING; PHASE COARSENING;

TIN ALLOYS;

EID: 39849091932     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0014-3     Document Type: Article

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