A nonlocal diffuse interface model for microstructure evolution of tin-lead solder

Journal of the Mechanics and Physics of Solids

Volumn 52, Issue 8, 2004, Pages 1763-1792

  Ubachs, R L J M ^a   Schreurs, P J G ^a   Geers, M G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Coarsening; Diffuse interface; Evolving microstructure; Nonlocal; Phase field model; Tin lead solder

Indexed keywords

ALGORITHMS; COMPUTATIONAL METHODS; COMPUTER SIMULATION; CRACK INITIATION; CRACK PROPAGATION; DIFFUSION; ELASTICITY; INTERFACES (MATERIALS); LEAD ALLOYS; MICROSTRUCTURE; TIN ALLOYS;

COARSENING; DIFFUSE INTERFACES; EVOLVING MICROSTRUCTURE; PHASE-FIELD MODELS; TIN-LEAD SOLDERS;

SOLDERING ALLOYS;

EID: 3042634638     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmps.2004.02.002     Document Type: Article

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