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Materials Science and Engineering: A

Volumn 356, Issue 1-2, 2003, Pages 8-16

Effect of an electric field on microstructure coarsening in 60Sn40Pb solder joints

(2) Jung, Kang a Conrad, Hans a

a North Carolina State University (United States)

Author keywords

Electric field; Kinetics; Microstructure coarsening; Phase size distribution

Indexed keywords

ANNEALING; DIFFUSION; ELECTRIC FIELD EFFECTS; EUTECTICS; MICROSTRUCTURE; SOLDERED JOINTS;

PHASE SIZE DISTRIBUTIONS (PSD);

MATERIALS SCIENCE;

FATIGUE; JOINT; MICROSTRUCTURE; SOLDER;

EID: 0041972701 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/S0921-5093(02)00851-1 Document Type: Article

Times cited : (9)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.