A dual burn-in policy for defect-tolerant memory products using the number of repairs as a quality indicator

Microelectronics Reliability

Volumn 48, Issue 3, 2008, Pages 471-480

  Tong, Seung Hoon ^a   Yum, Bong Jin ^b  

^a SAMSUNG Electronics   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DATA REDUCTION; FAULT TOLERANCE; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR STORAGE; WSI CIRCUITS;

DEFECT TOLERANT MEMORY PRODUCTS; QUALITY INDICATORS;

DYNAMIC RANDOM ACCESS STORAGE;

EID: 39449095743     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.03.009     Document Type: Article

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