Burn-in effect on yield

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 4, 2000, Pages 293-299

  Kim, Taeho ^a   Kuo, Way ^b   Chien, Wei Ting Kary ^c  

^a KT Cooperation   (South Korea)

^b TEXAS A AND M UNIVERSITY   (United States)

^c Semiconductor Manufacturing Company Science Based Industrial Park   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC BREAKDOWN OF SOLIDS; NUMERICAL METHODS; RELIABILITY;

DEFECT DENSITY;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034290347     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.895074     Document Type: Article

References (10)

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