A unified model Incorporating yield, burn-in, and reliability

Naval Research Logistics

Volumn 51, Issue 5, 2004, Pages 704-719

  Kim, Kyungmee O ^a   Kuo, Way ^b  

^a UNIVERSITY OF ALBERTA   (Canada)

^b UNIVERSITY OF TENNESSEE   (United States)

Author keywords

Extrinsic reliability; Reliability defects; Yield defects; Yield models

Indexed keywords

EXTRINSIC RELIABILITY; RELIABILITY DEFECTS; YIELD DEFECTS; YIELD MODELS;

CORRELATION METHODS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; POISSON DISTRIBUTION; PROBABILITY; RELIABILITY; YIELD STRESS;

MICROELECTRONICS;

EID: 3843073132     PISSN: 0894069X     EISSN: None     Source Type: Journal    
DOI: 10.1002/nav.20023     Document Type: Article

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