On moisture diffusion modeling using thermal-moisture analogy

Journal of Electronic Packaging

Volumn 129, Issue 4, 2007, Pages 421-426

  Yoon, Samson ^b   Han, Bongtae ^a,b   Wang, Zhaoyang ^c  

^a ASME

^b UNIVERSITY OF MARYLAND   (United States)

^c Catholic University of America ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; MATHEMATICAL MODELS; THERMAL LOAD;

EQUATIONS OF HEAT; MOISTURE DIFFUSION MODELING; THERMAL-MOISTURE ANALOGY;

MOISTURE;

EID: 38749128718     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2804090     Document Type: Article

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