Moisture absorption and diffusion characterization of molding compound

Journal of Electronic Packaging

Volumn 127, Issue 4, 2005, Pages 460-465

  Chen, Xu ^a   Zhao, Shufeng ^a   Zhai, Linda ^b  

^a TIANJIN UNIVERSITY   (China)

^b FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ATMOSPHERIC HUMIDITY; DIFFUSION; MOISTURE; SOLUBILITY; VAPOR PRESSURE;

FICK'S LAW; MOISTURE ABSORPTION; SATURATED VAPOR PRESSURE;

SHEET MOLDING COMPOUNDS;

EID: 29544432414     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2065707     Document Type: Article

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