Fast characterization for moisture properties of moulding compounds: Influence of temperature and humidity

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 185-190

  Vogels, R C J ^a,b   Huang, M ^b   Yang, D G ^b,c   Van Driel, W D ^d   Zhang, G Q ^c,d  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY   (China)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^d NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE (MECHANICAL); HEAT TREATMENT; MOISTURE; PRINTED CIRCUIT BOARDS;

MOISTURE PROPERTIES; MOISTURE SENSITIVITY LEVELS (MSL); MOULDING COMPOUNDS;

INTEGRATED CIRCUITS;

EID: 33846325105     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564610     Document Type: Conference Paper

References (9)

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3. The Role of Penetrant Structure on the Transport and Mechanical Properties of a Thermoset Adhesive, K. S. Kwan, 1998
4. A Comparison of the Theory of Moisture Diffusion in Plastic Encapsulated Microelectronics With Moisture Sensor Chip and Weight-Gain Measurements, Haleh Ardebili, Craig Hillman, Marjorie Ann Erickson Natishan, Patrick McCluskey, Michael G. Pecht, Dave Peterson, march 2002
5. M.A.J. van Gils, et al, Characterization and Modeling of Moistures Driven Interface Failures, Microelectronics Reliability 44 (11), 2004, pp. 1317-1322.
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7. E.H. Wong et al, Moisture Diffusion and Vapour Pressure Modeling of IC Packaging, Proc. ECTC 1998, pp 1372-1378.
8. R. Dudek et al, Studies on Moisture Diffusion and Popcorn Cracking, Proc. EuroSimE 2002, pp. 225-232.
9. W.D. van Driel et al, Driving mechanisms of delamination related reliability problems in exposed pad packages, Proc EsimE2005, pp. 183-189.