Hygrothermal stress analysis of a plastic ball grid array package during solder reflow

Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science

Volumn 218, Issue 9, 2004, Pages 957-970

  Chang, K C ^a   Yeh, M K ^b   Chiang, K N ^b  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Hygrothermal stress; Plastic ball grid array; Solder reflow; Thermal and moisture diffusion

Indexed keywords

ABSORPTION; DESORPTION; DIFFUSION; FINITE ELEMENT METHOD; MOISTURE; STRESSES;

PLASTIC BALL GRID ARRAYS (PBGA); SOLDER REFLOW;

STRESS ANALYSIS;

FINITE ELEMENT ANALYSIS;

EID: 5444221763     PISSN: 09544062     EISSN: None     Source Type: Journal    
DOI: 10.1243/0954406041991260     Document Type: Article

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