Effect of moisture on the interfacial adhesion of the underfill/solder mask interface

Journal of Electronic Packaging

Volumn 124, Issue 2, 2002, Pages 106-110

  Ferguson, Timothy ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039486038     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1414133     Document Type: Article

References (8)

1. Solomon, J. S., Hanlin, D., and McDevitt, N. T., 1979, "Adhesive-Adherend Bond Joint Characterization by Auger Electron Spectroscopy and Photoelectron Spectroscopy," Polymer Science and Technology, L. Lee, ed., Plenum Press, New York, 12A, pp. 103-122.
2. Vroonhoven, J., 1993, "Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits," ASME J. Electron. Packag., 115, pp. 28-33.
3. Soles, C., Chang, T., Gidley, D., and Yee, A., 2000, "Contributions of the Nanovoid Structure to the Kinetics of Moisture Transport in Epoxy Resins," J. Polym. Sci., Part B: Polym. Phys., 38, pp. 776-791.
4. Wong, C. P., Shi, S., and Jefferson, G., 1997, "High Performance No-Flow Underfill for Low-Cost Flip-Chip Applications," IEEE Electronic Components and Technology Conference, pp. 850-858.
5. Hutchinson, J., and Suo, Z., 1992, "Mixed Mode Cracking in Layered Materials," Advances in Applied Mechanics, Vol. 29, Academic Press, New York.
6. Malyshev, B., and Salganik, R., 1965, "The Strength of Adhesive Joints Using the Theory of Cracks," Int. J. Fract. Mech., 1, pp. 114-128.
7. Dundurs, J., 1969, "Edge-bonded Dissimilar Orthogonal Elastic Wedges," ASME J. Appl. Mech., 36, pp. 650-652.
8. Ferguson, T., and Qu, J., 2001, "Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials," accepted for publication in the ASME J. Electron. Packag.