Challenges in cooling design of CPU packages for high-performance servers

Heat Transfer Engineering

Volumn 29, Issue 2, 2008, Pages 178-187

  Wei, Jie ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; HEAT PIPES; PROGRAM PROCESSORS; SERVERS; THERMAL VARIABLES CONTROL;

CPU PACKAGES; HIGH-PERFORMANCE SERVERS; PACKAGE COOLING CHARACTERISTICS;

ELECTRONICS PACKAGING;

EID: 38349119696     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457630701686727     Document Type: Conference Paper

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