Using cap-integral standoffs to reduce chip hot-spot temperatures in electronic packages

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 173-178

  June, Michael S ^a   Sikka, Kamal K ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

Chip temperature gradients; Electronic cooling; Hot spots; Standoffs; Thermal resistance

Indexed keywords

COOLING SYSTEMS; ENERGY DISSIPATION; HEAT RESISTANCE; MATHEMATICAL MODELS; MICROELECTRONICS; MICROPROCESSOR CHIPS; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

ELECTRONIC COOLING;

ELECTRONICS PACKAGING;

EID: 0036457895     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. "Thermally Efficient Semiconductor Chip," S. Shinde, J. Knickerbocker and K.K. Sikka, U.S. Patent 6,292,367 B1.
2. "Gap-Reduced Thermal Paste Package Design for Cooling Single Flip-Chip Electronic Modules," K.K. Sikka, H.T. Toy, D.L. Edwards, S. Iruvanti, E.M. Ingalls and P.W. DeHaven, submitted to ITHERM 2002, San Diego, May 2002.
3. Flotherm 3.1, Flomerics Inc., Marlborough, MA 01752, 2001.
4. "Advanced Thermal Tester for Accurate Measurement of the Internal Thermal Resistance of High Power Electronic Modules," K.K. Sikka, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, June 2001, pp. 226-232.