High-performance flip-chip BGA technology based on thin-core and coreless package substrate

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1869-1873

  Koide, Masateru ^a   Fukuzono, Kenji ^a   Yoshimura, Hideaki ^a   Sato, Toshihisa ^a   Abe, Kenichiro ^b   Fujisaki, Hidehiko ^b  

^a FUJITSU LABORATORIES LTD   (Japan)

^b Fujitsu Interconnect Technologies Limited   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BGA TECHNOLOGY; METALLIC THERMAL INJECTION; SUBSTRATE PACKAGING TECHNOLOGY; V-G IMPEDANCE;

ASSEMBLY; ELECTRIC IMPEDANCE; ELECTRONICS PACKAGING; LSI CIRCUITS; SERVERS;

FLIP CHIP DEVICES;

EID: 33845592967     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645915     Document Type: Conference Paper

References (2)

1. Takashi Shuto, "Next genereation high density build-up package substrate.", ECWC10
2. th Microelectronics symposium.p151-154.