Modeling of vapor chamber as heat spreading devices

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 578-585

  Xiaojin, Wei ^a   Sikka, Kamal ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

Electronic cooling; Heat spreader; Thermal management; Vapor chamber

Indexed keywords

ELECTRONIC COOLING; HEAT SPREADERS; THERMAL MANAGEMENT; VAPOR CHAMBERS;

HEAT LOSSES; HEAT SINKS; HEAT TRANSFER; THERMAL CONDUCTIVITY;

TEMPERATURE CONTROL;

EID: 33845587813     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645397     Document Type: Conference Paper

References (10)

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