Performance, production, and applications of advanced metal diamond composite heat spreader

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 742-747

  Bollina, Ravi ^a   Landgraf, J ^a   Wagner, H ^a   Wilhelm, R ^a   Knippscheer, S ^a   Tabernig, B ^a  

^a PLANSEE SE   (Austria)

Author keywords

Diamond composites; Electronics; Heat spreader; Pressure infiltration; Thermal management

Indexed keywords

COMPOSITE MICROSTRUCTURES; DIAMOND COMPOSITES; HEAT SPREADERS; HIGH THERMAL CONDUCTIVITY; HIGH-POWER DENSITY ELECTRONICS; MULTICORE ARCHITECTURES; PRESSURE INFILTRATION; SEMICONDUCTOR COMPONENTS;

COMPUTER ARCHITECTURE; DIAMONDS; ELECTRONIC EQUIPMENT; HEATING EQUIPMENT; MICROELECTRONICS; OPTOELECTRONIC DEVICES; POWER ELECTRONICS; STRESSES; SUBSTRATES; TEMPERATURE; TEMPERATURE CONTROL; TUNGSTEN;

THERMAL CONDUCTIVITY;

EID: 84876588519     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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