Air-cooling extension - Performance limits for processor cooling applications

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 74-81

  Sauciuc, Ioan ^a   Chrysler, Greg ^a   Mahajan, Ravi ^a   Szleper, Michele ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Air cooling; Electronics cooling; Heat transfer coefficient; Heatsinks; Spreading

Indexed keywords

ANISOTROPY; BOUNDARY CONDITIONS; COOLING; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; MICROELECTRONICS; RELAXATION PROCESSES; SEMICONDUCTING SILICON; THERMAL CONDUCTIVITY; HEAT RESISTANCE; MICROPROCESSOR CHIPS; TEMPERATURE CONTROL; TEMPERATURE DISTRIBUTION; THERMAL VARIABLES MEASUREMENT;

AIR-COOLING TECHNOLOGY; ELECTRONICS COOLING; POWER DENSITY; PROCESSOR COOLING; THERMAL DESIGN POWER;

MICROPROCESSOR CHIPS; COOLING;

AIR-COOLING TECHNOLOGY; JUNCTION TEMPERATURES; LOCAL POWER DENSITIES; MICROELECTRONICS INDUSTRY; ORIGINAL EQUIPMENT MANUFACTURERS; THERMAL ENGINEERING; THERMAL FACTORS; US DEPARTMENT OF ENERGY;

EID: 0037275247     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Azar, K., "Power Consumption and Generation in the Electronics Industry- A Perspective", Proc of 16th Semi-Therm Conf, pp. 201-212, 2000.
2. Sauciuc, I., Chrysler, G., Mahajan, R., Prasher, R., "Spreading in the heatsink base: Phase change systems or solid metals?", Proc Thermes, Santa Fe, New Mexico, USA, 2001.
3. Rohensaw, J., P., Hartent, J., P., and Ganic, M., "Handbook of heat transfer" Second Edition, McGraw-Hill Book, (New York, 1985).
4. Incropera, D. P. De Witt, "Fundamentals of Heat and Mass Transfer", John Wiley & Sons Inc., (Canada: 1990).