Thermal management of Fujitsu's high-performance servers

Fujitsu Scientific and Technical Journal

Volumn 43, Issue 1, 2007, Pages 122-129

  Wei, Jie ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

LOWER DEVICE JUNCTION TEMPERATURES; POWER DISSIPATION; THERMAL DESIGN; THERMAL INTERFACE;

COOLING SYSTEMS; ELECTRONICS PACKAGING; ENERGY DISSIPATION; MICROPROCESSOR CHIPS; PRODUCT DESIGN; RELIABILITY;

SERVERS;

EID: 33847043461     PISSN: 00162523     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

1. International Technology Roadmap for Semiconductors 2005 Edition Assembly and Packaging. http://www.itrs.net/Links/2005ITRS/AP2005.pdf
2. th International Symposium on Transport Phenomena, Toyama, Japan, 2006.
3. I. Sauciuc et al.: Air-cooling Extension - Performance Limits for Processor Cooling Applications. Proceedings of 19th IEEE Semi -Therm Symposium, San Jose, USA, 2003, p.74-81.
4. J. Wei et al.: Thermal Management of Multiple MCMs with Low-Temperature Liquid Cooling. Proceedings of InterPACK'01, Hawaii, USA, 2001, p.1-10.
5. O. Hamada: High-Reliability Technology of Mission-Critical IA server PRIMEQUEST. FUJITSU Sci. Tech. J., 41, 3, p.284-290 (2005).
6. J. Wei et al.: Thermal Management of Fujitsu High-End UNIX Servers. Proceedings of InterPACK'05, San Francisco, USA, 2005, p. 1-7.
7. K. Aoki et al.: Automatic Thermal Modeling for System Level Design of Electronic Equipment. Proceedings of InterPACK'03, Hawaii, USA, 2003, p. 1-6.
8. J. Wei et al.: Effects of Asymmetric Power Distributions on Thermal Management of High Performance LSI Processors. Proceedings of IFHT2004, Kyoto, Japan, 2004, p.37-39.
9. M. Koide et al.: High-Performance Flip-Chip EGA Technology Based on Thin-Core and Coreless Package Substrates. Proceedings of 56th ECTC, San Diego, USA, 2006, p. 1869-1873.
10. J. Wei et al.: Measurement of Vapor Chamber Performance. Proceedings of 19th IEEE Semi-Therm Symposium, San Jose, USA, 2003, p.191-194.
11. J. Y. Chang et al.: Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions. Proceedings of InterPACK'05, San Francisco, USA, 2005, p. 1-7.