Thermal modeling of multi-core processors

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 96-100

  Xu, Guoping ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

Air cooling; Circuit design; Electronic package; Thermal model

Indexed keywords

AIR-COOLING; CIRCUIT DESIGNS; HOT SPOTS; THERMAL MODELS;

ELECTRONICS PACKAGING; HEAT SINKS; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; PRODUCT DEVELOPMENT; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMODYNAMIC PROPERTIES;

MICROPROCESSOR CHIPS;

EID: 33845566917     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645327     Document Type: Conference Paper

References (8)

1. D. Greenley, "UltraSPARC IV+ Processor", Fall Processor Forum 2004, Oct. 4-6, 2004, San Jose, CA
2. J. D. Warnock et al., "The Circuit and Physical Design of the Power4 Microprocessor," IBM J. Res. & Dev., Vol. 46, No. 1, pp. 27-51, 2002
3. G. Xu, B. Guenin and M. Vogel, 2004, "Extension of air cooling for high power processors," Proceedings of ITHERM, pp. 186-193
4. A. Kairsare, D. Agonafer, H. Haji-shiekh, G. Chrysler and R. Mahajan, 2005, "Thermal based optimization of functional block distributions in a non-uniformly powered die," Proceedings of InterPACK '05, San Francisco, CA, USA
5. th International Symposium on Microelectronics, IMPAPS 2002, Denver
6. J. Wei and M. Suzuki, 2005, "Thermal management of Fujitsu High-end Unix servers," Proc. of InterPACK '05, San Francisco, CA, USA
7. th IEEE SEMITHERM Symposium.
8. th IEEE SEMI-THERM Symposium, pp. 95-101