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Journal of the Electrochemical Society

Volumn 152, Issue 3, 2005, Pages

Electroless deposited cobalt-tungsten-boron capping barrier metal on damascene copper interconnection

(3) Nakano, H a Itabashi, T a Akahoshi, H a

a HITACHI LTD (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COPPER; DIFFUSION; ELECTROCHEMISTRY; ELECTROLESS PLATING; INTERFACES (MATERIALS); METALLIC FILMS; OXIDATION; REDUCTION; SCANNING ELECTRON MICROSCOPY;

COPPER INTERCONNECTION; CROSS-SECTIONAL STRUCTURE; DIFFUSION BARRIER; METAL CAPPING;

COBALT ALLOYS;

EID: 15744387093 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1860512 Document Type: Article

Times cited : (65)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.