Stress evolution and defect diffusion in Cu during low energy ion irradiation: Experiments and modeling

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 26, Issue 1, 2008, Pages 44-51

  Chan, Wai Lun ^a,b   Chason, Eric ^a  

^a Brown University   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECT DIFFUSION; STRESS EVOLUTION;

COMPRESSIVE STRESS; COPPER; ION IMPLANTATION; IRRADIATION; POINT DEFECTS; TENSILE STRESS; THERMAL EFFECTS; VACANCIES;

STRESS ANALYSIS;

EID: 37849038423     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2812432     Document Type: Article

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