Surface stress induced in Cu foils during and after low energy ion bombardment

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Volumn 257, Issue 1-2 SPEC. ISS., 2007, Pages 428-432

  Chan, Wai Lun ^a   Chason, Eric ^a   Iamsumang, C ^a  

^a Brown University   (United States)

Author keywords

Ar implantation; Cu; Defects; Ion bombardment; Sputtering; Stress

Indexed keywords

COMPRESSIVE STRESS; COPPER; ION IMPLANTATION; SPUTTERING; STRESS RELAXATION; TENSILE STRESS;

DEFECT GENERATION; FLUX DEPENDENCE; SURFACE STRESS; WAFER CURVATURE TECHNIQUE;

ION BOMBARDMENT;

EID: 33947629613     PISSN: 0168583X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nimb.2007.01.042     Document Type: Article

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