Interfacial reactions of Sn-Cu and Sn-Pb-Ag solder with Au/Ni during extended time reflow in ball grid array packages

Journal of Materials Research

Volumn 19, Issue 10, 2004, Pages 2897-2904

  Islam, M N ^a   Chan, Y C ^a   Sharif, A ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD; GROWTH (MATERIALS); INTERFACES (MATERIALS); INTERMETALLICS; MELTING; METALLIZING; NICKEL; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SURFACE REACTIONS;

BINARY INTERMETALLIC COMPOUNDS (BIMC); EXTENDED TIME REFLOW; GRID ARRAY PACKAGES; INTERFACIAL REACTIONS; RAPID FORMATION; TERNARY INTERMETALLIC COMPOUNDS (TIMC);

TIN ALLOYS;

EID: 6344221731     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0399     Document Type: Article

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