Observation of amorphous chromium in modified C4 flip chip solder joints after thermal stress testing

Thin Solid Films

Volumn 437, Issue 1-2, 2003, Pages 235-241

  Hooghan, T K ^a   Nakahara, S ^a   Hooghan, K ^a   Privette, R W ^a   Bachman, M A ^a   Moyer, R S ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

Flip chip; Focused ion beam; Solder; Transmission electron microscopy; Under bump metallization

Indexed keywords

AMORPHOUS FILMS; CHROMIUM; DIFFUSION; POROSITY; SOLDERED JOINTS; THERMAL EXPANSION; THERMAL STRESS; TRANSMISSION ELECTRON MICROSCOPY;

UNDER-BUMP-METALLIZATION (UBM) LAYERS;

FLIP CHIP DEVICES;

EID: 0038108639     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00679-5     Document Type: Article

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