Microstructure evolution during electromigration in eutectic SnPb solder bumps

Journal of Materials Research

Volumn 19, Issue 8, 2004, Pages 2394-2401

  Lu, C M ^a   Shao, T L ^a   Yang, C J ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANODES; CATHODES; COPPER COMPOUNDS; ELECTROMIGRATION; EUTECTICS; FAILURE (MECHANICAL); FLIP CHIP DEVICES; METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; SOLDERING ALLOYS; SUBSTRATES;

EUTECTIC SOLDERS; FAILURE MECHANISM; MICROSTRUCTURAL EVOLUTION; SOLDER BUMPS; TIN LEAD; UNDERBUMP METALLIZATION;

TIN ALLOYS;

EID: 4644294587     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0305     Document Type: Article

References (12)

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