NiW-Micro springs for chip connection

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 117-120

  Kruger C ^a,b   Mokwa, W ^a   Schnakenberg, U ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b ThyssenKrupp Transrapid GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROLYTES; ELECTROPLATING; ETCHING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; SPRINGS (COMPONENTS);

CHIP CONNECTIONS; CONTACT RESISTANCE; MICROSPRINGS; SPRING CONSTANT;

INTEGRATED CIRCUIT TESTING;

EID: 3042783194     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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