Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 1, Issue , 2003, Pages 408-411

  Chow, E M ^a   Hantschel, T ^a   Klein, K ^b   Fork, D K ^a   Chua, C L ^a   Wong, L ^a   Van Schuylenbergh, K ^a  

^a PALO ALTO RESEARCH CENTER   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Application specific integrated circuits; Conductive films; Contacts; Force measurement; Integrated circuit packaging; Metrology; Microelectromechanical systems; Micromechanical devices; Probes; Springs

Indexed keywords

ACTUATORS; APPLICATION SPECIFIC INTEGRATED CIRCUITS; ASPECT RATIO; CONDUCTIVE FILMS; CONTACTS (FLUID MECHANICS); ELECTROMECHANICAL DEVICES; FORCE MEASUREMENT; INTEGRATED CIRCUITS; MEASUREMENTS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMECHANICS; MICROSYSTEMS; PROBES; SPRINGS (COMPONENTS); TRANSDUCERS; UNITS OF MEASUREMENT;

ELECTRICAL CONTACTS; FORCE CHARACTERIZATION; FRETTING EXPERIMENTS; INTEGRATED CIRCUIT PACKAGING; MICRO ELECTROMECHANICAL SYSTEM (MEMS); MICROMECHANICAL DEVICE; NON-DESTRUCTIVE IMAGING; ORDERS OF MAGNITUDE;

SOLID-STATE SENSORS;

EID: 84944739341     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1215340     Document Type: Conference Paper

References (20)

1. T. Hantschel, L. Wong, C.L. Chua, D.K. Fork, Fabrication of highly conductive stressed-metal springs and their use as sliding contact interconnects", in Micro and Nanoengineering Conf. 2002, Lugano, Switzerland, Sept. 16-19,2002.
2. D.L. Smith, A. S. Alimonda, "A new flip-chip technology for high-density packaging", 46th Electronic Components and Technology Conf., Orlando, Florida, May 1996, pp. 1069-1073.
3. See www.nanonexus.com
4. C.L. Chua, D.K. Fork, and T. Hantschel, "Densely packed optoelectronic interconnect using micromachined springs," IEEE Photon. Technol. Lett., vol. 14 (6), pp. 846-848, 2002.
5. T. Hantschel, E.M. Chow, D. Rudolph, D.K. Fork, "Stressed metal probes for atomic force microscopy", Applied Physics Letters, vol. 81 (16), pp. 3070-3072.
6. J.H. Haemer, S.K. Sitaraman, D.K. Fork, F.C. Chong, S. Mok, D.L. Smith, F. Swiatowiec, "Flexible Micro-Spring Interconnects for High-Performance Probing", Electronic Components and Technology Conf., 2000, pp. 1157-1163.
7. C. Maul, J.W. McBride, J. Swingler, "Inermittency phenomena in electrical connectors", IEEE Transactions on Components and Packaging Technologies, vol. 24. No. 3, Sept. 2001.
8. H. Tian, N. Saka, E. Rabinowicz, "Fretting Failure of Electroplated Gold Contacts", Wear, vol. 142, 1991, pp. 265-289.
9. N. Aukland, H. Hardee, A. Wehr, S. Brennan, P. Lee, "An Examination of the Metallic Bonding of a Clad Meterial and Two Gold Plating Systems under Constant Force Fretting Conditions", in Proc. 43rd Holm Conf. on Electrical Contacts, 1997, pp 7-19.
10. B. Pruitt, D.-H. Choi, J. Florando, R. Martens, S. Wenzel, C.Reynolds, W. Nix, and T. Kenny, "Low force electrical contact measurements using piezoresistive MEMS cantilevers to characterize thin-film metallization." Proceedings of 2001 EuroSensors XV, pp. 1032-35.
11. T. Itoh, K. Kataoka, T. Suga, "Characteristics of low force contact process for MEMS probe cards", Sensors and Actuators A, vol. 97-98, 2002, p. 462-467.
12. D. Hyman, M, Mehregany, "Contact Physics of Gold Microcontacts for MEMS Switches", in Proc. 44th Holm Conf. on Electrical Contacts, 1998, pp. 133-140.
13. S.R. Murrell, S.L. McCarthy, "Intermittence Detection in Fretting Corrosion Studies of Electrical Contacts", in Proc. 43rd Holm Conf. on Electrical Contacts, 1997, pp.1-6.
14. W. Abbott, K. Schreiber, "Dynamic Contact Resistance of gold, tin and palladium connector interfaces during low amplitude motion", in Proc. Holm Conf. on Electrical Contacts, 1981, pp. 211-219.
15. F. Hubner-Obenland, J. Minuth, "A New Test Equipment For High Dynamic Real-Time Measuring of Contact Resistances", in Proc. 46th Holm Conf. on Electrical Contacts, 1999, pp. 193-202.
16. M. Antler, M.H. Drozdowicz, "Fretting Corrosion of Gold-Plated Connector Contacts", Wear, vol 74, 1981, pp. 27-50.
17. H. Tian, N. Saka, E. Rabinowicz, "Fretting Failure of Electroplated Gold Contacts", Wear, vol. 142, 1991, pp. 265-289.
18. E. M. Chow, H. T. Soh, H. C. Lee, J. D. Adams, S. C. Minne, G. Yaralioglu, A. Atalar, C. F, Quate, and T. W. Kenny, Sens. Actuators vol. 83, 2000, pp. 118-121.
19. A. Yahata, S. Urano, T. Inoue, "Striations on Si Trench Sidewalls Observed by Atomic Force Microscopy", Japanese Journal of Applied Physics, vol. 36 (1997), pp. 6722-6723.
20. A. Ali, V. Ukrainstev, H. Sabri, M. Yang, "Nondestructive via-in-hole profile characterization using atomic force metrology", J. Vac. Sci. Technol. B. vol. 20 (1), Jan/Feb, 2002, pp. 95-99.