Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Journal of Electronic Packaging

Volumn 124, Issue 4, 2002, Pages 411-418

  Ahmad, Mudasir ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347014039     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1512296     Document Type: Article

References (10)

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3. Haemer, J. M., S. K. Sitaraman, D. K. Fork, F. C. Chong, S. Mok, D. L. Smith, and F. Swiatowiec, 2000, "Flexible micro spring interconnects for high performance probing," Proc., 50th Electronics Components and Technology Conference (ECTC). May, pp. 1157-1163.
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6. Fischer-Cripps, A. C., 2000, Introduction to Contact Mechanics, Mechanical Engineering Series, Springer Verlag New York (Berlin, Germany), pp. 166-167, 177-215.
7. Johnson, K. L., 1985, Contact Mechanics, Cambridge University Press (Cambridge), pp. 233-239.
8. Childs, T. H. C., 1970, "The Sliding of Rigid Cones over Metals in High Adhesion Conditions," Int. J. Mech. Sci., 12, pp. 393-403.
9. Ahmad, M., and S. K. Sitaraman, 2001, "Coupled Thermal Electric Modeling of Felixible Micro-Spring Interconnects for High Performance Probing," Proc., 51st Electronics Components and Technology Conference (ECTC).
10. Slade, P. G., 1999, Electrical Contact, Principles and Applications, Cutler-Hammer Horseheads (New York), pp. 2-20.