Micro-springs for temporary chip connections

Sensors and Actuators, A: Physical

Volumn 85, Issue 1, 2000, Pages 371-376

  Kruger C ^a   Bartelink, D J ^b   Fritz, T ^a   Leuerer, T ^a   Mokwa, W ^a   Schnakenberg, U ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DEFECTS; DESIGN FOR TESTABILITY; ENCAPSULATION; FABRICATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; MICROACTUATORS; MICROSENSORS; MOUNTINGS; MULTICHIP MODULES;

COMPOSITE INTEGRATED CIRCUITS; MICROSPRINGS; TEMPORARY CHIP CONNECTIONS;

SPRINGS (COMPONENTS);

EID: 0042028861     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(00)00401-5     Document Type: Article

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