Characteristics of low force contact process for MEMS probe cards

Sensors and Actuators, A: Physical

Volumn 97-98, Issue , 2002, Pages 462-467

  Itoh, Toshihiro ^a   Kataoka, Kenichi ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

Atomic force microscope; Fritting contact; MEMS probe card

Indexed keywords

ADHESION; ALUMINUM; ATOMIC FORCE MICROSCOPY; CALCULATIONS; COPPER; ELECTROPLATING; FILMS; INTEGRATED CIRCUIT TESTING; INTERFACES (MATERIALS); MICROMACHINING; NICKEL; PROBES;

ADHESION FORCES; CONTACT FORCES; ELECTROPLATED NICKEL CANTILEVER PROBE; FRITTING; LOW FORCE CONTACT PROCESS; MICROELECTROMECHANICAL PROBE CARDS; MICROMACHINED CANTILEVER PROBES;

MICROELECTROMECHANICAL DEVICES;

EID: 0036544470     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00822-6     Document Type: Conference Paper

References (7)

1. A new MEMS wafer probe card
2. Thermally actuated microprobes for a new wafer probe card
3. Applicability of MEMS probe card to wafer-level test
4. A micromachined array probe card-characterization
5. Characteristics of fritting contacts utilized for micromachined wafer probe cards
6. In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structures