Cu-compatible ultra-high permittivity dielectrics for embedded passive components

Materials Research Society Symposium - Proceedings

Volumn 783, Issue , 2003, Pages 145-150

  Ihlefeld, Jon F ^a   Kingon, Angus I ^a   Borland, William ^b   Maria, Jon Paul ^a  

^a North Carolina State University   (United States)

^b DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BARIUM TITANATE; CAPACITORS; EMBEDDED SYSTEMS; INTEGRATED CIRCUITS; OXIDATION; PERMITTIVITY; THIN FILMS;

CAPACITANCE DENSITY; FERROELECTRIC SWITCHING; PASSIVE COMPONENTS; ULTRA-HIGH PERMITTIVITY;

COPPER;

EID: 3042536583     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-783-b3.2     Document Type: Conference Paper

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