Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1375-1380

  Sundaram, Venky ^a   Tummala, Rao ^a   Wiedenman, Boyd ^a   Liu, Fuhan ^a   Raj, P Markondeya ^a   Abothu, Isaac Robin ^a   Bhattacharya, Swapan ^a   Varadarajan, Mahesh ^b   Bongio, Ed ^c   Sherwood, Walt ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b INDIAN INSTITUTE OF SCIENCE   (India)

^c Starfire Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ORGANIC LAMINATES; PLASMA SURFACE TREATMENT; SYSTEM-ON-A-PACKAGE (SOP) TECHNOLOGY; THIN FILM COMPONENTS;

DIELECTRIC FILMS; OPTICAL DEVICES; PERMITTIVITY; SENSORS; SUBSTRATES; THIN FILM DEVICES;

ELECTRONICS PACKAGING;

EID: 33845572716     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645836     Document Type: Conference Paper

References (9)

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