Thin film low inductance decoupling device for high speed digital circuits

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 277-281

  Takafuji, J ^a   Konushi, S ^a   Nakashima, H ^a   Ueda, S ^a   Fukumaru, F ^a   Nambu, S ^a  

^a KYOCERA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DECOUPLING CAPACITORS; DIELECTRIC LAYERS; HIGH SPEED DIGITAL (HSD) CIRCUITS;

CAPACITANCE; CAPACITORS; DIELECTRIC FILMS; DIGITAL DEVICES; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRODES; INDUCTANCE; SPUTTERING; SWITCHING; THIN FILMS;

DIGITAL CIRCUITS;

EID: 10444270149     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. R.G.Werner and C.S.Chang, The 4th VLSI Packaging Workshop of Japan, 1998.
2. W.D.Becker, J.Eckhardt, R.W.Frech, G.A.Katopis, E.Klink, M.F.McAllister, T.G.McNamara, P.Muench, S.R.Richter and H.H.Smith, IEEE Trans. Comp., Packag., Manufact. Technol. Part B, Vol.21, No.3, pp.157-163, Aug. 1998.
3. Keunmyung Lee, Solid State Technology, pp.85- 88, Sept. 1998.
4. K.Nakamata and M.Nishimura, Electronics and Communications in Japan, Part2, Vol.75, No.11, pp.81-90, 1992.
5. Su-Hyon PEAK, Jinhee WON, Kong-Soo LEE, Jin-Seog CHOI and Chi-Sun PARK, J. Appl. Phys. Vol. 35 pp5757-5762, 1996
6. K.Ahn, B.W.Wisseles, J. Mater. Res., Vol.18, No.5 pp 1227-1231, 2003
7. Ki Hoon Lee, Cheol Seong Hwang, Byoung Taek Lee, Wan don Kim, Hedeki Horii, Chang Seok Kang, Hag-Ju Cho, Sang In Lee and Moon Young Lee, J.Appl. Phys. Vol. 36 Part 1,No. 9B, pp.5860-5865, Sep. 1997