Ceramic resistors and capacitors embedded in organic printed wiring boards

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 713-718

  Borland, William ^a   Felten, John J ^a   Dellis, Lynne E ^a   Ferguson, Saul ^a   Majumdar, Diptarka ^a   Jones, Alton B ^a   Lux, Mark S ^a   Traylor, Richard R ^a   Doyle, Marc ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; BARIUM COMPOUNDS; CERAMIC CAPACITORS; ETCHING; LANTHANUM COMPOUNDS; MICROSTRUCTURE; PHOTORESISTORS; POROSITY; RESISTORS; THERMAL CYCLING; THICK FILMS; THICKNESS MEASUREMENT; BARIUM; BARIUM TITANATE; BORIDES; CAPACITORS; CERAMIC MATERIALS; ELECTRONICS PACKAGING; LAMINATING; PRINTED CIRCUIT BOARDS;

CAPACITANCE DENSITY; EMBEDDED PASSIVES; BOARD DESIGN; CAPACITOR MATERIALS; CERAMIC COMPONENT; COPPER FOILS; INNER LAYER; MATRIX; PREPREGS; PRINTED WIRING BOARDS; TIGHT TOLERANCES;

PRINTED CIRCUIT BOARDS; THICK FILM CIRCUITS;

EID: 1242309364     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35090     Document Type: Conference Paper

References (7)

1. W. J. Borland and S. Ferguson, "Embedded Passive Components in Printed Wiring Boards: A Technology Review," Circuitree, March 2001.
2. D. MacGregor, "Standards Development Efforts for Embedded Passive Materials," IPC Annual Meeting, October 2001.
3. P. Sandborn, B. Etienne, and D. Becker, "Analysis of the Cost of Embedded Passives in Printed Circuit Boards," IPC Annual Meeting, October 2001.
4. J. Savic, R. T. Croswell, A. Tungare, G. Dunn, T. Tang, R. Lempkowski, M. Zhang, and T. Lee, "Embedded Passives Technology Implementation in RF Applications," IPC Expo, March 2002.
5. J. J. Felten and S. Ferguson "Embedded Ceramic Resistors and Capacitors in PWB - Process and Design," IPC Expo, March 2002.
6. AEPT website: www.aept.ncms.org
7. th, 2001, Baltimore, MD