High-aspect ratio metal tips attached to atomic force microscopy cantilevers with controlled angle, length, and radius for electrostatic force microscopy

Review of Scientific Instruments

Volumn 78, Issue 11, 2007, Pages

  Cockins, Lynda ^a   Miyahara, Yoichi ^a   Stomp, Romain ^a   Grutter, Peter ^a  

^a MCGILL UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ATOMIC FORCE MICROSCOPY; ELECTROSTATIC FORCE; METALS; MICROFABRICATION;

ELECTROSTATIC FORCE MICROSCOPY; METAL TIPS; PYRAMIDAL TIPS;

CANTILEVER BEAMS;

METAL;

ARTICLE; ATOMIC FORCE MICROSCOPY; ELECTRICITY; EQUIPMENT; EQUIPMENT DESIGN; EVALUATION; IMAGE ENHANCEMENT; INSTRUMENTATION; METHODOLOGY; REPRODUCIBILITY; SENSITIVITY AND SPECIFICITY; TRANSDUCER;

ELECTROSTATICS; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; IMAGE ENHANCEMENT; METALS; MICROSCOPY, ATOMIC FORCE; REPRODUCIBILITY OF RESULTS; SENSITIVITY AND SPECIFICITY; TRANSDUCERS;

EID: 36749061986     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2805513     Document Type: Article

References (26)

1. J. E. Stern, B. D. Terris, H. J. Mamin, and D. Rugar, Appl. Phys. Lett. 53, 2717 (1988).
2. C. Schonenberger and S. F. Alvarado, Phys. Rev. Lett. 65, 3162 (1990).
3. J. Zhu, M. Brink, and P. L. McEuen, Appl. Phys. Lett. 87, 242102 (2005).
4. P. Fallahi, A. C. Bleszynski, R. M. Westervelt, J. Huang, J. D. Walls, E. J. Heller, M. Hanson, and A. C. Gossard, Nano Lett. 5, 223 (2005).
5. L. Klein and C. Williams, Appl. Phys. Lett. 79, 1828 (2001).
6. L. Klein and C. Williams, Appl. Phys. Lett. 81, 4589 (2002).
7. A. Dana and Y. Yamamoto, Nanotechnology 16, S125 (2005).
8. R. Stomp, Y. Miyahara, S. Schaer, Q. Sun, H. Guo, P. Grutter, S. Studenikin, P. Poole, and A. Sachrajda, Phys. Rev. Lett. 94, 056802 (2005).
9. H. O. Jacobs, H. F. Knapp, S. Mueller, and A. Stemmer, Ultramicroscopy 69, 39 (1997).
10. H. O. Jacobs, P. Leuchtmann, O. J. Homan, and A. Stemmer, J. Appl. Phys. 84, 1168 (1998).
11. S. Belaidi, P. Girard, and G. Leveque, Microelectron. Reliab. 37, 1627 (1997).
12. H. O. Jacobs, H. F. Knapp, and A. Stemmer, Rev. Sci. Instrum. 70, 1756 (1999).
13. S. B. Arnason, A. G. Rinzler, Q. Hudspeth, and A. F. Hebard, Appl. Phys. Lett. 75, 2842 (1999).
14. N. R. Wilson and J. V. Macpherson, J. Appl. Phys. 96, 3565 (2004).
15. S. D. Tzeng, C. L. Wu, Y. C. You, T. T. Chen, S. Gwo, and H. Tokumoto, Appl. Phys. Lett. 81, 5042 (2002).
16. K. Akiyama, T. Eguchi, T. An, Y. Fujikawa, Y. Yamada-Takamura, T. Sakurai, and Y. Hagegawa, Rev. Sci. Instrum. 76, 033705 (2005).
17. T. Eguchi, Y. Fujikawa, K. Akiyama, T. An, M. Ono, T. Hashimoto, Y. Morikawa, K. Terakura, T. Sakurai, M. G. Lagally, Phys. Rev. Lett. 93, 266102 (2004).
18. C. Menozzi, G. C. Gazzadi, A. Alessandrini, and P. Facci, Ultramicroscopy 104, 220 (2005).
19. S. Hudlet, M. Saint-Jean, C. Guthmann, and J. Berger, Eur. Phys. J. B 2, 5 (1998).
20. J. Colchero, A. Gil, and A. M. Baró, Phys. Rev. B 64, 245403 (2001).
21. M. Roseman and P. Grutter, Rev. Sci. Instrum. 71, 3782 (2000).
22. H20E, Epoxy Technology (http://www.epotek.com).
23. M. J. Vasile, D. Grigg, J. E. Griffith, E. Fitzgerald, and P. E. Russell, J. Vac. Sci. Technol. B 9, 3569 (1991).
24. NSC16 with etched Si tip, MikroMasch (http://www.stmtips.com).
25. T. R. Albrecht, P. Grutter, D. Horne, and D. Ruger, J. Appl. Phys. 69, 668 (1991).
26. J. E. Sader and S. P. Jarvis, Appl. Phys. Lett. 84, 1801 (2004).